류 84 · Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof
8456
Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines
Máy công cụ để gia công mọi loại vật liệu bằng cách bóc tách vật liệu, bằng các quy trình sử dụng tia laser hoặc tia sáng khác hoặc chùm phô-tông, siêu âm, phóng điện, điện hóa, chùm tia điện tử, chùm tia i-on hoặc quá trình xử lý plasma hồ quang; máy cắt bằng tia nước
8456 아래 12개 세번
세율은 8단위 수준에서 정해집니다. 물품에 맞는 세번을 선택하세요.
| HS 코드 | 설명 | 단위 | 일반 수입세 | MFN | VAT |
|---|---|---|---|---|---|
| 8456.11.10 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by laser or other light or photon beam processes: / - - Operated by laser: / - - - Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 85.17, or parts of automatic data processing machines | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.11.90 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by laser or other light or photon beam processes: / - - Operated by laser: / - - - Other | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.12.10 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by laser or other light or photon beam processes: / - - Operated by other light or photon beam processes: / - - - Of a kind used solely or principally for the manufacture of printed circuits, printed circuit assemblies, parts of heading 85.17, or parts of automatic data processing machines | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.12.90 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by laser or other light or photon beam processes: / - - Operated by other light or photon beam processes: / - - - Other | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.20.00 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by ultrasonic processes | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.30.00 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by electro-discharge processes | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.40.10 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by plasma arc processes: / - - Machine-tools, numerically controlled, for working any material by removal of material, by plasma arc processes, for the manufacture of printed circuit boards or printed wiring boards | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.40.20 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by plasma arc processes: / - - Plasma cleaner machines that remove organic contaminants from electron microscopy specimens and specimen holders | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.40.90 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Operated by plasma arc processes: / - - Other | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.50.00 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Water-jet cutting machines | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.90.20 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Other: / - - Wet processing equipment for the application by immersion of electrochemical solutions, for the purpose of removing material on printed circuit boards or printed wiring boards | unit/set | 5% | 0% | 8 / 10 (여러 세율) |
| 8456.90.90 | Machine-tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines / - Other: / - - Other | unit/set | 5% | 0% | 8 / 10 (여러 세율) |